Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min

High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

Product Tags:

Extended Bottom Brazing Hybrid Integrated Circuit Package

Ceramic Metal Insulator Al2O3 Hybrid Integrated Circuit Package

Hermetic Hybrid Integrated Circuit Package

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